Heat releasing plate for mounting semiconductor components



FIG. 1 is a front view of the heat releasing plate for mounting semiconductor components showing the new design;

FIG. 2 is a plan view thereof;

FIG. 3 is a bottom view thereof;

FIG. 4 is a right side view thereof; and

FIG. 5 is a sectional view taken on line 5--5 of FIG. 1. 

The ornamental design for heat releasing plate for mounting semiconductor components, as shown and described. 